Finetech offers innovative equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages.

Manual, semi-automatic and automatic FINEPLACER® systems are available, and have a modular design for maximum process flexibility. Applications range from R&D and prototype environments (high-accuracy, low-volume) to more fully-automated production with higher volumes.

Full Finetech Segment - Advancements with Ted Danson
6:10
Full Finetech Segment - Advancements with Ted Danson
Finetech in 30 seconds
0:31
Finetech in 30 seconds
Reactive Soldering with Laser Activation - FINEPLACER® femto 2 / femto blu
2:15
Reactive Soldering with Laser Activation - FINEPLACER® femto 2 / femto blu
Multi-purpose Manual Die Bonder for Lab & Research - FINEPLACER® pico 2
3:44
Multi-purpose Manual Die Bonder for Lab & Research - FINEPLACER® pico 2
Die Bonder for Chip on Submount (CoS) Assembly - FINEPLACER® femto blu
2:42
Die Bonder for Chip on Submount (CoS) Assembly - FINEPLACER® femto blu
Die Bonder for Chip on Submount (CoS) Assembly - FINEPLACER® femto blu
2:06
Die Bonder for Chip on Submount (CoS) Assembly - FINEPLACER® femto blu
FINEPLACER lambda 2 - the ultimate tool for opto assemblies
4:17
FINEPLACER lambda 2 - the ultimate tool for opto assemblies
Finetech Company Video
1:13
Finetech Company Video
Face-up Assembly of VCSEL and PD - FINEPLACER® lambda
3:07
Face-up Assembly of VCSEL and PD - FINEPLACER® lambda
Face Down VCSEL Assembly on Transceiver Modules - FINEPLACER® lambda
1:35
Face Down VCSEL Assembly on Transceiver Modules - FINEPLACER® lambda
High Accuracy Automatic Die Bonder - FINEPLACER® femto 2
2:00
High Accuracy Automatic Die Bonder - FINEPLACER® femto 2
FINEPLACER® femto2 Automated Prototype2Production Bonder
0:45
FINEPLACER® femto2 Automated Prototype2Production Bonder
Sub-Micron Sensor Assembly - FINEPLACER® sigma
2:19
Sub-Micron Sensor Assembly - FINEPLACER® sigma
FINEPLACER® sigma - Semi-automated Sub-Micron Bonder
0:43
FINEPLACER® sigma - Semi-automated Sub-Micron Bonder
Rework of CPU/GPU Components with FINEPLACER® Rework Systems
2:31
Rework of CPU/GPU Components with FINEPLACER® Rework Systems
BGA rework cycle - Finetech Rework Station
3:59
BGA rework cycle - Finetech Rework Station
automatic sensor assembly / sensor bonding - FINEPLACER® femto
2:03
automatic sensor assembly / sensor bonding - FINEPLACER® femto
FINEPLACER® femto - Manual Control with a 3D Joystick
0:41
FINEPLACER® femto - Manual Control with a 3D Joystick
Die Flipping with FINEPLACER® femto - Die Flipping Unit
0:42
Die Flipping with FINEPLACER® femto - Die Flipping Unit
3D-Stacking / Bonding with FINEPLACER® femto
1:37
3D-Stacking / Bonding with FINEPLACER® femto
BGA residual solder removal - Finetech rework station
0:57
BGA residual solder removal - Finetech rework station
Contactless residual solder removal - Finetech Rework Station
1:18
Contactless residual solder removal - Finetech Rework Station
Laser Bar Bonding using Au/Sn Process - Finetech Bonder
4:01
Laser Bar Bonding using Au/Sn Process - Finetech Bonder
Lab, R&D and Prototyping Die Bonding - Finetech Bonder
2:56
Lab, R&D and Prototyping Die Bonding - Finetech Bonder
Thermosonic Bonding using Au-Au process - Finetech Bonder
2:43
Thermosonic Bonding using Au-Au process - Finetech Bonder
Solder paste dispensing (motorized) - Finetech
0:30
Solder paste dispensing (motorized) - Finetech
CSP rework on mobile phone board - Finetech Rework Station
4:22
CSP rework on mobile phone board - Finetech Rework Station
How to reball BGA components
4:14
How to reball BGA components
BGA Reballing on stand-alone Reballer - Martin (a Finetech company)
2:11
BGA Reballing on stand-alone Reballer - Martin (a Finetech company)
BGA Rework: removal using nitrogen
0:12
BGA Rework: removal using nitrogen