System Verilog forDesign
20:01
System Verilog forDesign
How to succeed doing a PhD in Electrical and Computer Engineering
1:05:27
How to succeed doing a PhD in Electrical and Computer Engineering
Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC
29:37
Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC
Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama
23:42
Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama
Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications
22:11
Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications
Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni
26:41
Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf
22:42
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf
Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs
25:12
Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs
Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU
20:19
Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU
3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU
22:42
3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU
Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross
27:37
Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross
Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay
30:59
Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay
Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB
32:17
Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB
3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST
34:16
3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST
Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi
36:28
Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi
3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech
35:22
3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech
2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University
56:27
2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University
Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor
54:29
Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor
3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch
59:23
3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch
3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm
1:02:12
3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm
Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel
54:32
Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel
Introduction2v2
38:29
Introduction2v2
Introduction1v2
25:06
Introduction1v2
Revision
28:09
Revision
Reset
18:31
Reset
Do a PhD in ECE at NC State University
1:29
Do a PhD in ECE at NC State University
Digital Logic Basics Review - 3. Computer Arithmetic
9:52
Digital Logic Basics Review - 3. Computer Arithmetic
Digital Logic Basics Review - Sequential Logic
13:05
Digital Logic Basics Review - Sequential Logic
Digital Logic Basics Review 1. Combinational Logic
13:17
Digital Logic Basics Review 1. Combinational Logic
Doing an MS degree in Electrical and Computer Engineering at NC State University
0:50
Doing an MS degree in Electrical and Computer Engineering at NC State University